GlobalFoundries, Arm Close in on 3D Chip Integration

Chipmaker GlobalFoundries (GF) and semiconductor IP firm Arm say they’ve completed the design for a test silicon 3D chip using technology capable of making a million 3D connections per square millimeter. Their technology binds two wafers of chips together with densely packed vertical copper links. The companies see it as a path to boosting the movement of data for applications such as machine learning, and to allowing the integration of different technologies such as RF and silicon photonics.

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